Travel: NSF Student Travel Grant for 2026 IEEE International Symposium on Dynamic Spectrum Access Networks (IEEE DySPAN)

This proposal seeks to fund US-based students to attend IEEE DySPAN 2026, held in Washington, DC on May 11-14, 2026. DySPAN is a premier conference focused on enhancing spectrum innovation to address the increasing need for wireless capacity across various applications. The conference brings together researchers, engineers, policymakers, and industry professionals to discuss the latest developments, challenges, and innovations in dynamic spectrum access and related areas. DySPAN 2026 will expose selected students to cutting-edge developments in the field and enable interactions with world-leading researchers. Students will gain feedback on their ongoing work, broaden their academic perspectives, and build lasting professional connections.

DySPAN 2026 will feature topics on advanced wireless technologies and applications, artificial intelligence and machine learning in spectrum access and management for 6G and emerging use cases, security and privacy issues in spectrum access and management, public safety and emergency services spectrum, and software standardization and equipment certification.

This project supports students from US universities to attend the 2026 DySPAN conference in person. Students will have the opportunity to present their work and be exposed to state-of-the-art developments in the field. They will also have the opportunity to interact with peers from institutions worldwide, meet with senior researchers, and participate in discussions that are likely to shape the future of the field.

This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

Award Number: 2620645
Principal Investigator: Ish Kumar Jain
Funds Obligated: $15,000
State: NY