grant
CAREER: Process Technology-based Electronic Design Automation Framework Development for Efficient Monolithic Three-dimensional (3D) Integration
Organization North Dakota State University FargoLocation FARGO, United StatesPosted 15 Feb 2025Deadline 31 Jan 2030
NSFUS FederalResearch GrantScience FoundationND
Description preview
A monolithic three-dimensional integrated circuit (M3D IC) is a promising alternative for realizing compact and efficient ICs since conventional two-dimensional integration is limited by lithography and power constraints. In M3D IC technology, the substrate layers are realized sequentially, and these layers are connected through metal inter-layer…
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