grant
ENG-SEMICON: Manufacturing USA: Plasticity-Induced Cu-Cu Bonding for Scalable 3D Chip Integration in Advanced Semiconductor Packaging
Organization SUNY at BinghamtonLocation BINGHAMTON, United StatesPosted 1 Jul 2025Deadline 30 Jun 2028
NSFUS FederalResearch GrantScience FoundationNY
Description preview
Recent advancements in artificial intelligence (AI) are driving an unprecedented need for higher interconnect density in 3D-stacked semiconductor chips, with interconnect pitches scaling less than 1 micrometer. However, such ultrafine-scales cannot be achieved using current microbump technology, necessitating the development of novel approach such…
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