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CAREER: Optimizing the Next Frontiers of Chiplet-based Designs in Advanced Packaging

Organization Auburn UniversityLocation AUBURN, United StatesPosted 1 May 2025Deadline 30 Apr 2030
NSFUS FederalResearch GrantScience FoundationAL
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Modern Artificial Intelligence (AI) workloads demand computing systems with large silicon areas to sustain throughput and performance. However, manufacturing costs, yield limitations at advanced tech nodes, and die sizes reaching the reticle limit restrain us from achieving this on a monolithic die. With the recent innovations in advanced…

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CAREER: Optimizing the Next Frontiers of Chiplet-based Designs in Advanced Packaging — Auburn University | United States | Dev Procure